Rotating speed and magnetic pole dependency assisted on copper deposition onto aluminum alloy substrate for bacterial eradication application
Main Article Content
Abstract
Copper (Cu) is widely used in many sectors, such as drinking water piping, heat exchangers, and medical equipment. The present research conducted an electrodeposition of Cu over an aluminum (Al) alloy substrate under the influence of various magnetic poles and rotating speeds. In the present study, a number of investigations, including deposition rate, current efficiency, coating thickness, surface morphology and phase, crystallographic orientation, antibacterial activity, electrochemical behavior, and hardness test were conducted. Increasing the rotation speed promoted to enhanced deposition rate and current efficiency for both magnetic poles influence. An increase in the deposition rate from 12.83 to 13.67 µm/h led to the increasing thickness, a change in surface morphology near the spheroidal, becoming a faceted structure. Presenting and rising in the rotation of a magnetic field led to a reduced surface roughness and crystallite size of Cu film for both magnetic poles influence. The Cu film made without spinning magnetic had a characteristic of highest bacterial inhibition zone around 2.50 ±0.56 cm². The CuRN50 sample had the lowest corrosion rate at around 0.055 mmpy, while the CuRS100 sample had the highest hardness value at approximately 80.72 HV for having the lowest crystallite size. Cu coated onto Al alloy could enhance its properties, such as being antimicrobial, being resistant against corrosion and having the hardness value.
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Basori, B., Ruliyanta, Ajiriyanto, M. K., Kriswarini, R., Hardiyanti, H., Rosyidan, C., Yudanto, S. D., Situmorang, E. U. M., Edbert, D., Nanto, D., & Susetyo, F. B. (2025). Rotating speed and magnetic pole dependency assisted on copper deposition onto aluminum alloy substrate for bacterial eradication application. Communications in Science and Technology, 10(1), 17-28. https://doi.org/10.21924/cst.10.1.2025.1547
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References
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K. Ko?odziejczyk, E. Mi?ko?, M. Zieli?ski, M. Jaksender, D. Szczukocki, K. Czarny et al., Influence of constant magnetic field on electrodeposition of metals, alloys, conductive polymers, and organic reactions, J. Solid State Electrochem. 22 (2018) 1629–1674.
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T. Wang and W. Chen, Effects of Rotating Magnetic Fields on Nickel Electro-Deposition, ECS Electrochem. Lett. 4 (2015) D14–D17.
R. Ji, K. Han, H. Jin, X. Li, Y. Liu, S. Liu et al., Preparation of Ni-SiC nano-composite coating by rotating magnetic field-assisted electrodeposition, J. Manuf. Process. 57 (2020) 787–797.
S. Syamsuir, F. B. Susetyo, B. Soegijono, S. D. Yudanto, Basori and D. Nanto, Nickel layers properties produced by electroplating were influenced by spinning permanent magnet, in Journal of Physics: Conference Series, 2596 (2023), pp. 012008.
X. Qu, H. Yang, B. Jia, Z. Yu, Y. Zheng and K. Dai, Biodegradable Zn–Cu alloys show antibacterial activity against MRSA bone infection by inhibiting pathogen adhesion and biofilm formation, Acta Biomater. 117 (2020) 400–417.
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X. Qiao, H. Li, W. Zhao and D. Li, Effects of deposition temperature on electrodeposition of zinc-nickel alloy coatings, Electrochim. Acta 89 (2013) 771–777.
M. A. Lopez-Heredia, P. Weiss and P. Layrolle, An electrodeposition method of calcium phosphate coatings on titanium alloy, J. Mater. Sci. Mater. Med. 18 (2007) 381–390.
G. Yang, D. Deng, Y. Zhang, Q. Zhu and J. Cai, Numerical Optimization of Electrodeposition Thickness Uniformity with Respect to the Layout of Anode and Cathode, Electrocatalysis 12 (2021) 478–488.
F. B. Susetyo, B. Soegijono and Yusmaniar, Effect of a constant magnet position and intensity on a copper layer obtained by DC electrodeposition, Int. J. Corros. Scale Inhib. 10 (2021) 766–782.
Y. Lin, J. Pan, H. F. Zhou, H. J. Gao and Y. Li, Mechanical properties and optimal grain size distribution profile of gradient grained nickel, Acta Mater. 153 (2018) 279–289.
D. Grujicic and B. Pesic, Reaction and nucleation mechanisms of copper electrodeposition from ammoniacal solutions on vitreous carbon, Electrochim. Acta 50 (2005) 4426–4443.
Halo Dalshad Omar, Intensity Correction and Pole Figure Measurement of Copper Metallic by XRD, J. Basic Appl. Sci. 12 (2016) 320–322.
F. Briones, V. Seriacopi, C. Martínez, J. L. Valin, D. Centeno and I. F. Machado, The effects of pressure and pressure routes on the microstructural evolution and mechanical properties of sintered copper via SPS, J. Mater. Res. Technol. 25 (2023) 2455–2470.
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S. Alfei, G. C. Schito, A. M. Schito and G. Zuccari, Reactive Oxygen Species (ROS)-Mediated Antibacterial Oxidative Therapies: Available Methods to Generate ROS and a Novel Option Proposal, Int. J. Mol. Sci. 25 (2024) .
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A. R. Mir, J. Pichtel and S. Hayat, Copper: uptake, toxicity and tolerance in plants and management of Cu-contaminated soil, BioMetals 34 (2021) 737–759.
F. N. S. Raja, T. Worthington and R. A. Martin, The antimicrobial efficacy of copper, cobalt, zinc and silver nanoparticles: alone and in combination, Biomed. Mater. 18 (2023) 045003.
S. Y. Tsai, Y. M. Liu, Z. W. Lin and C. P. Lin, Antimicrobial activity effects of electrolytically generated hypochlorous acid-treated pathogenic microorganisms by isothermal kinetic simulation, J. Therm. Anal. Calorim. 148 (2023) 1613–1627.
D. Markovic, C. Deeks, T. Nunney, Z. Radovanovic, M. Radoicic, Z. Saponjic et al., Antibacterial activity of Cu-based nanoparticles synthesized on the cotton fabrics modified with polycarboxylic acids, Carbohydr. Polym. 200 (2018) 173–182.
Z. Z. Tasic, M. B. Petrovic Mihajlovic, M. B. Radovanovic and M. M. Antonijevic, Electrochemical investigations of copper corrosion inhibition by azithromycin in 0.9% NaCl, J. Mol. Liq. 265 (2018) 687–692.
C. Zheng, J. Cao, Y. Zhang and H. Zhao, Insight into the Oxidation Mechanism of a Cu-Based Oxygen Carrier (Cu ? Cu2O ? CuO) in Chemical Looping Combustion, Energy and Fuels 34 (2020) 8718–8725.
B. Narayanan, S. A. Deshmukh, S. K. R. S. Sankaranarayanan and S. Ramanathan, Strong correlations between structural order and passive state at water-copper oxide interfaces, Electrochim. Acta 179 (2015) 386–393.
S. Ghosh, Electroless copper deposition: A critical review, Thin Solid Films 669 (2019) 641–658.
M. M. Lachowicz, A metallographic case study of formicary corrosion in heat exchanger copper tubes, Eng. Fail. Anal. 111 (2020) 104502.
N. Thokala, C. Kealey, J. Kennedy, D. B. Brady and J. B. Farrell, Characterisation of polyamide 11/copper antimicrobial composites for medical device applications, Mater. Sci. Eng. C 78 (2017) 1179–1186.
A. Augustin, P. Huilgol, K. R. Udupa and U. B. K, Effect of current density during electrodeposition on microstructure and hardness of textured Cu coating in the application of antimicrobial Al touch surface, J. Mech. Behav. Biomed. Mater. 63 (2016) 352–360.
Syamsuir, F. B. Susetyo, B. Soegijono, S. D. Yudanto, Basori, M. K. Ajiriyanto et al., Rotating-Magnetic-Field-Assisted Electrodeposition of Copper for Ambulance Medical Equipment, Automot. Exp. 6 (2023) 290–302.
A. M. Alghamdi and F. Fadhillah, Thin film composite polyelectrolyte multilayer nanofiltration membrane fabricated using spin assisted layer by layer assembly: Application of solution diffusion film model, Commun. Sci. Technol. 5 (2020) 10–15.
C. Santoso, Ratnawati and Slamet, Utilization of glycerol solution for hydrogen production by a combination of photocatalysis and electrolysis processes with Fe-TiO2 nanotubes, Commun. Sci. Technol. 8 (2023) 208–215.
W. Trisunaryanti, K. Wijaya and A. M. Tazkia, Preparation of Ni/ZSM-5 and Mo/ZSM-5 catalysts for hydrotreating palm oil into biojet fuel, Commun. Sci. Technol. 9 (2024) 161–169.
A. Lelevic and F. C. Walsh, Electrodeposition of Ni-P alloy coatings: A review, Surf. Coatings Technol. 369 (2019) 198–220.
I. S. Brandt, M. A. Tumelero, S. Pelegrini, G. Zangari and A. A. Pasa, Electrodeposition of Cu2O: growth, properties, and applications, J. Solid State Electrochem. 21 (2017) 1999–2020.
A. Antenucci, S. Guarino, V. Tagliaferri and N. Ucciardello, Improvement of the mechanical and thermal characteristics of open cell aluminum foams by the electrodeposition of Cu, Mater. Des. 59 (2014) 124–129.
A. Kusior, J. Mazurkow, P. Jelen, M. Bik, S. Raza, M. Wdowiak et al., Copper Oxide Electrochemical Deposition to Create Antiviral and Antibacterial Nanocoatings, Langmuir 40 (2024) 14838–14846.
N. N. C. Isa, Y. Mohd, M. H. M. Zaki and S. A. S. Mohamad, Antibacterial activity of copper coating electrodeposited on 304 stainless steel substrate, in AIP Conference Proceedings, 1901 (2017), pp. 020009.
H. A. Murdoch, D. Yin, E. Hernández-Rivera and A. K. Giri, Effect of applied magnetic field on microstructure of electrodeposited copper, Electrochem. commun. 97 (2018) 11–15.
Q. Long, Y. Zhong and J. Wu, Research progress of magnetic field techniques for electrodeposition of coating, Int. J. Electrochem. Sci. 15 (2020) 8026–8040.
K. Ko?odziejczyk, E. Mi?ko?, M. Zieli?ski, M. Jaksender, D. Szczukocki, K. Czarny et al., Influence of constant magnetic field on electrodeposition of metals, alloys, conductive polymers, and organic reactions, J. Solid State Electrochem. 22 (2018) 1629–1674.
B. Soegijono, F. B. Susetyo, Yusmaniar and M. C. Fajrah, Electrodeposition of paramagnetic copper film under magnetic field on paramagnetic aluminum alloy substrates, e-Journal Surf. Sci. Nanotechnol. 18 (2020) 281–288.
D. Yin, H. A. Murdoch, B. Chad Hornbuckle, E. Hernández-Rivera and M. K. Dunstan, Investigation of anomalous copper hydride phase during magnetic field-assisted electrodeposition of copper, Electrochem. commun. 98 (2019) 96–100.
M. Miura, Y. Oshikiri, A. Sugiyama, R. Morimoto, I. Mogi, M. Miura et al., Magneto-Dendrite Effect: Copper Electrodeposition under High Magnetic Field, Sci. Rep. 7 (2017) 1–8.
S. V. Kovalyov, O. B. Girin, C. Debiemme-Chouvy and V. I. Mishchenko, Copper electrodeposition under a weak magnetic field: effect on the texturing and properties of the deposits, J. Appl. Electrochem. 51 (2021) 235–243.
Y. Liu, B. Zheng, T. Zhang, Y. Chen, J. Liu, Z. Wang et al., Magnetic field intensified electrodeposition of low-concentration copper ions in aqueous solution, Electrochim. Acta 432 (2022) 141201.
Sudibyo, M. B. How and N. Aziz, Influences of magnetic field on the fractal morphology in copper electrodeposition, in IOP Conference Series: Materials Science and Engineering, 285 (2018), pp. 012021.
T. Wang and W. Chen, Effects of Rotating Magnetic Fields on Nickel Electro-Deposition, ECS Electrochem. Lett. 4 (2015) D14–D17.
R. Ji, K. Han, H. Jin, X. Li, Y. Liu, S. Liu et al., Preparation of Ni-SiC nano-composite coating by rotating magnetic field-assisted electrodeposition, J. Manuf. Process. 57 (2020) 787–797.
S. Syamsuir, F. B. Susetyo, B. Soegijono, S. D. Yudanto, Basori and D. Nanto, Nickel layers properties produced by electroplating were influenced by spinning permanent magnet, in Journal of Physics: Conference Series, 2596 (2023), pp. 012008.
X. Qu, H. Yang, B. Jia, Z. Yu, Y. Zheng and K. Dai, Biodegradable Zn–Cu alloys show antibacterial activity against MRSA bone infection by inhibiting pathogen adhesion and biofilm formation, Acta Biomater. 117 (2020) 400–417.
Syamsuir, R. S. Kusumah, A. Premono, A. Lubi, B. Soegijono, S. D. Yudanto et al., Spinning Effect of Barreling Plating on Physical Properties and Electrochemical Behavior of Copper Layers, e-Journal Surf. Sci. Nanotechnol. 22 (2024) 120–128.
A. C. Larson and R. B. Von Dreele, General Structure Analysis System (GSAS), Vol. 748, University of California, Los Alamos, 2004.
R. M. Yusron, R. M. Bisono and M. Pramudia, Effect Electrolyte Temperature and Electrode Distance to Electroplating Hard-Chrome on Medium-Carbon Steel, J. Phys. Conf. Ser. 1569 (2020) 042007.
X. Qiao, H. Li, W. Zhao and D. Li, Effects of deposition temperature on electrodeposition of zinc-nickel alloy coatings, Electrochim. Acta 89 (2013) 771–777.
M. A. Lopez-Heredia, P. Weiss and P. Layrolle, An electrodeposition method of calcium phosphate coatings on titanium alloy, J. Mater. Sci. Mater. Med. 18 (2007) 381–390.
G. Yang, D. Deng, Y. Zhang, Q. Zhu and J. Cai, Numerical Optimization of Electrodeposition Thickness Uniformity with Respect to the Layout of Anode and Cathode, Electrocatalysis 12 (2021) 478–488.
F. B. Susetyo, B. Soegijono and Yusmaniar, Effect of a constant magnet position and intensity on a copper layer obtained by DC electrodeposition, Int. J. Corros. Scale Inhib. 10 (2021) 766–782.
Y. Lin, J. Pan, H. F. Zhou, H. J. Gao and Y. Li, Mechanical properties and optimal grain size distribution profile of gradient grained nickel, Acta Mater. 153 (2018) 279–289.
D. Grujicic and B. Pesic, Reaction and nucleation mechanisms of copper electrodeposition from ammoniacal solutions on vitreous carbon, Electrochim. Acta 50 (2005) 4426–4443.
Halo Dalshad Omar, Intensity Correction and Pole Figure Measurement of Copper Metallic by XRD, J. Basic Appl. Sci. 12 (2016) 320–322.
F. Briones, V. Seriacopi, C. Martínez, J. L. Valin, D. Centeno and I. F. Machado, The effects of pressure and pressure routes on the microstructural evolution and mechanical properties of sintered copper via SPS, J. Mater. Res. Technol. 25 (2023) 2455–2470.
X. Xu, Z. Liu, B. Zhang, H. Chen, J. Zhang, T. Wang et al., Effect of Mn content on microstructure and properties of 6000 series aluminum alloy, Appl. Phys. A Mater. Sci. Process. 125 (2019) 1–9.
C. O. Ayieko, R. J. Musembi, A. A. Ogacho, B. O. Aduda, B. M. Muthoka and P. K. Jain, Controlled Texturing of Aluminum Sheet for Solar Energy Applications, Adv. Mater. Phys. Chem. 05 (2015) 458–466.
M. Hubab and M. A. Al-Ghouti, Recent advances and potential applications for metal-organic framework (MOFs) and MOFs-derived materials: Characterizations and antimicrobial activities, Biotechnol. Reports 42 (2024) e00837.
S. J. Kim, J. Chang and M. Singh, Peptidoglycan architecture of Gram-positive bacteria by solid-state NMR, Biochim. Biophys. Acta - Biomembr. 1848 (2015) 350–362.
X. Chen, Y. Li, K. Bai, M. Gu, X. Xu, N. Jiang et al., Class A Penicillin-Binding Protein C Is Responsible for Stress Response by Regulation of Peptidoglycan Assembly in Clavibacter michiganensis, Microbiol. Spectr. 10 (2022) .
S. Xhafa, L. Olivieri, C. Di Nicola, R. Pettinari, C. Pettinari, A. Tombesi et al., Copper and Zinc Metal–Organic Frameworks with Bipyrazole Linkers Display Strong Antibacterial Activity against Both Gram+ and Gram? Bacterial Strains, Molecules 28 (2023) 6160.
A. Azam, A. S. Ahmed, M. Oves, M. S. Khan and A. Memic, Size-dependent antimicrobial properties of CuO nanoparticles against Gram-positive and -negative bacterial strains, Int. J. Nanomedicine 7 (2012) 3527–3535.
J. Ramyadevi, K. Jeyasubramanian, A. Marikani, G. Rajakumar and A. A. Rahuman, Synthesis and antimicrobial activity of copper nanoparticles, Mater. Lett. 71 (2012) 114–116.
M. Ahamed, H. A. Alhadlaq, M. A. M. Khan, P. Karuppiah and N. A. Al-Dhabi, Synthesis, characterization, and antimicrobial activity of copper oxide nanoparticles, J. Nanomater. 2014 (2014) .
L. Huang, E. M. Fozo, T. Zhang, P. K. Liaw and W. He, Antimicrobial behavior of Cu-bearing Zr-based bulk metallic glasses, Mater. Sci. Eng. C 39 (2014) 325–329.
M. A. Hajduga, S. W?grzynkiewicz, J. Wa?-Solipiwo, M. Hajduga and M. B. Hajduga, Innovative solutions from the field of the material science and medicine in the interior of modern ambulances, Mater. Sci. Forum 844 (2016) 50–54.
P. L. Lam, R. S. M. Wong, K. H. Lam, L. K. Hung, M. M. Wong, L. H. Yung et al., The role of reactive oxygen species in the biological activity of antimicrobial agents: An updated mini review, Chem. Biol. Interact. 320 (2020) 109023.
S. Alfei, G. C. Schito, A. M. Schito and G. Zuccari, Reactive Oxygen Species (ROS)-Mediated Antibacterial Oxidative Therapies: Available Methods to Generate ROS and a Novel Option Proposal, Int. J. Mol. Sci. 25 (2024) .
A. A. Dayem, M. K. Hossain, S. Bin Lee, K. Kim, S. K. Saha, G. M. Yang et al., The role of reactive oxygen species (ROS) in the biological activities of metallic nanoparticles, Int. J. Mol. Sci. 18 (2017) 1–21.
A. R. Mir, J. Pichtel and S. Hayat, Copper: uptake, toxicity and tolerance in plants and management of Cu-contaminated soil, BioMetals 34 (2021) 737–759.
F. N. S. Raja, T. Worthington and R. A. Martin, The antimicrobial efficacy of copper, cobalt, zinc and silver nanoparticles: alone and in combination, Biomed. Mater. 18 (2023) 045003.
S. Y. Tsai, Y. M. Liu, Z. W. Lin and C. P. Lin, Antimicrobial activity effects of electrolytically generated hypochlorous acid-treated pathogenic microorganisms by isothermal kinetic simulation, J. Therm. Anal. Calorim. 148 (2023) 1613–1627.
D. Markovic, C. Deeks, T. Nunney, Z. Radovanovic, M. Radoicic, Z. Saponjic et al., Antibacterial activity of Cu-based nanoparticles synthesized on the cotton fabrics modified with polycarboxylic acids, Carbohydr. Polym. 200 (2018) 173–182.
Z. Z. Tasic, M. B. Petrovic Mihajlovic, M. B. Radovanovic and M. M. Antonijevic, Electrochemical investigations of copper corrosion inhibition by azithromycin in 0.9% NaCl, J. Mol. Liq. 265 (2018) 687–692.
C. Zheng, J. Cao, Y. Zhang and H. Zhao, Insight into the Oxidation Mechanism of a Cu-Based Oxygen Carrier (Cu ? Cu2O ? CuO) in Chemical Looping Combustion, Energy and Fuels 34 (2020) 8718–8725.
B. Narayanan, S. A. Deshmukh, S. K. R. S. Sankaranarayanan and S. Ramanathan, Strong correlations between structural order and passive state at water-copper oxide interfaces, Electrochim. Acta 179 (2015) 386–393.
S. Ghosh, Electroless copper deposition: A critical review, Thin Solid Films 669 (2019) 641–658.